SIEMENS EDA: Ensuring 3D IC semiconductor reliability

Companies are now upgrading to 3D IC as it helps them divide designs into separate silicon IP blocks and combine them using the best process node and process. This further results in low latency, high bandwidth data flow, reduced manufacturing costs, higher wafer yields, lower power consumption, and overall lower prices.

However, there are challenges while implementing 3D IC structure that every enterprise should consider.

This eBook showcases some of the challenges 3D IC assemblies impose when ensuring manufacturability and reliability.

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